Lausanne-based company Corintis, which builds microfluidic cooling for high-power chips, has secured €20 million in a Series A funding round, bringing its total raised to €28.5 million, led by BlueYard Capital.
- Founded in 2021 by Remco van Erp, Sam Harrison, and Elison Matioli, Corintis develops semiconductor cooling technologies aimed at overcoming one of computing’s most pressing bottlenecks: heat management in advanced chips. The company’s work builds on research conducted at the Swiss Federal Institute of Technology in Lausanne (EPFL).
- Its core technology centers on microfluidic cooling, which embeds networks of microscopic liquid channels directly inside or alongside computer chips. These channels guide coolant to the most heat-intensive regions of a processor, removing thermal energy more efficiently than conventional copper-based or air-cooled systems.
- By tailoring the flow of coolant to the architecture of each chip, Corintis’s approach enables higher power densities, maintains stable chip temperatures under heavy workloads, and reduces the energy consumption of data centers.
- The company has also developed supporting design and validation tools, such as Glacierware, a software platform to automate cooling system design, and Therminator, a testing solution to emulate next-generation chips, to help integrate its cooling systems with semiconductor manufacturers and data center operators.
“Every chip is unique. It’s like a cityscape with hundreds of billions of transistors, connected by countless wires. Cooling today is not adapted to the chip, relying on simplistic designs where several parallel fins are carved into a block of copper with a blade," explains Remco van Erp, co-founder and CEO of Corintis.
Details of the deal
- The round was led by BlueYard Capital, a Berlin-based early-stage deep-tech VC, with participation from Founderful, a Swiss pre-seed and seed investor, XTX Ventures, Celsius Industries, and Acequia Capital.
- The firm aims to scale its manufacturing capacity to over one million cooling systems per year, expand with new offices in the US and Germany, grow its team, and advance its technology platforms to deliver the next generation of chip cooling solutions.
